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LAM Electronics LAM 839-800327-315 Electrostatic Chuck

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The LAM 839-800327-315 Electrostatic Chuck is a precision tool designed for semiconductor wafer bonding processes, ensuring high accuracy and efficiency in manufacturing.

Material:Stainless Steel

Operating Temperature Range:-40°C to 200°C

Vacuum Holding Capacity:Up to 100mm Hg

Electrostatic Force Adjustment:Variable

Electrostatic Force Range:100N to 1000N

Power Supply Voltage:DC 24V

Dimensions:200mm x 200mm x 50mm

Introducing the LAM ELECTROSTATIC CHUCK 839-800327-315, a precision-engineered solution for semiconductor wafer processing. This robust component is meticulously designed to enhance the efficiency and accuracy of your production line. With its dual electrode configuration, it ensures uniform electrostatic force distribution across the wafer surface, facilitating precise alignment and processing conditions. Made from high-grade stainless steel, this chuck withstands extreme temperatures ranging from -40°C to +250°C, making it suitable for a wide range of semiconductor applications. Its adjustable electrostatic force, capable of ±500 mN, allows for fine-tuning to meet specific process requirements. Additionally, it is compatible with vacuum systems up to 10 Torr, ensuring compatibility with most semiconductor processing equipment. Designed for durability and performance, this LAM ELECTROSTATIC CHUCK is an essential upgrade for any semiconductor fabrication facility aiming to optimize yield and quality.

The LAM ELECTROSTATIC CHUCK 839-800327-315 boasts a sleek and compact design, measuring 8 inches in diameter and 1 inch in height. Its size is perfectly optimized to fit within standard semiconductor processing chambers without compromising on functionality or performance. The dual electrode system ensures that every point on the wafer is subjected to an optimal electrostatic force, leading to consistent and high-quality results.

Crafted from premium quality stainless steel, this chuck offers unparalleled resistance to wear and tear, even under the most demanding operational conditions. It is capable of enduring the harsh environments typical in semiconductor manufacturing, ensuring long-lasting performance and minimal maintenance requirements. This material choice also facilitates easy cleaning, which is crucial for maintaining the cleanliness standards required in semiconductor fabrication.

The LAM ELECTROSTATIC CHUCK 839-800327-315 comes equipped with an intuitive adjustment mechanism, allowing users to precisely control the electrostatic force applied to the wafer. This feature is invaluable for tailoring the processing environment to the specific needs of various semiconductor materials and processes. By offering such fine-grained control, operators can achieve better process repeatability and reduce the risk of defects during the manufacturing process.

Our commitment to quality extends beyond the product itself. The LAM ELECTROSTATIC CHUCK 839-800327-315 undergoes rigorous testing and quality assurance measures to ensure it meets the highest industry standards. Backed by comprehensive technical support, we provide guidance on installation, operation, and maintenance to help you maximize the performance and longevity of your investment. Choose the LAM ELECTROSTATIC CHUCK 839-800327-315 for reliable and efficient semiconductor processing, backed by our dedication to excellence and customer satisfaction.

LAM 839-800327-315 ELECTROSTATIC CHUCK

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